Heatsink
Heatsink for COM Express Basic Embedded Computer Modules
Intel® Core™ i3, i5, i7 , Intel® Celeron® 800 series , AMD R-Series Generation
The specifications for COM Express™ Embedded Computer Modules include a heatspreader.
It's a mechanical definition of the thermal interface.
All the heat generated by components such as chipsets and processors are transferred to the system's cooling via the heatspreader.
Various heatsinks and Cooling solutions for different system integration project.
Asia Pacific
10F-3, No. 270, Sec 4, Chung Hsiao E. Road, Taipei, 10694, Taiwan
Phone: +886-2-2751-7192
Email: [email protected]
EMEA
Ulrichsberger Str. 17, Haus G1, 94469 Deggendorf, Germany
Phone: +49-991-2009298-0
Email: [email protected]
Americas
1420 Kettner BLVD. #300 , San Diego,
CA 92101, USA
Phone: +1-760-525-1811
Email: [email protected]
UK & Ireland
Phone: +44 (0) 7976-155552
Email: [email protected]
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| COM Basic | |
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| COM Compact | |
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| COM Mini | |
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