1. Embedded Computing • Compact Fanless Box PCs • Industrial Panel PCs

4. EverFine Group Headquarters 10F-3, No. 270, Sec. 4, Chung Hsiao E. Rd., Taipei, 10694, Taiwan Tel: +886 2 2751-7192 [email protected] EMEA Ulrichsberger Str. 17 Haus G1, 94469 Deggendorf, Germany Tel: +49-991-2009298-0 [email protected] About EFCO Established in 1992, EFCO is a leading provider of embedded computer platforms with a demonstrated history of delivering solutions matched specifically to individual customer requirements. Our industrial-grade products cover a variety of vertical market solutions. These include Wide-temperature Rugged Fanless Computers, Multi-touch Panel PCs, Casino Gaming Solutions and IoT Nodes. We also offer COMe carriers board design service, OEM/ODM design and manufacturing services, and Computer on Module (SOM) thermal solutions. EFCO is headquartered in Taipei Taiwan, with offices in the USA, China, UK and Germany. EFCO has earned a reputation for quality control and reliability on product design and service. EFCO has successfully deployed customers’ solutions into Gaming, Digital Signage, Smart Factory, Machine Vision, In-Vehicle Transportation, Health Care, Security Control and Automation. EFCO has close partnerships with Intel® and AMD® to provide customers seamless support and time-to-market solution. EFCO is also a member of AIA, EtherCAT, and AGM. By participating in industrial organizations, and staying current on AIoT trends, EFCO aims to build integrated Application-Ready Platforms to provide various solutions, as well as contribute its insights to the market. Flexible and Collaborative Manufacturing Services With more than 26 years experience, EFCO offers turnkey manufacturing services with state-of-the-art production equipment for both PCB assembly and complete system builds. EFCO utilizes its professional manufacturing process with customized designs in support of small/medium/large-volume and high-mix orders to achieve quick production ramp up and competitive ROI benefits. EFCO’s in-house production center provides not only box-build services, but also Conformal Coating, Extended Temperature Screening and Burn-In services, etc. to ensure the best quality and product longevity. International Quality Assurance Standards EFCO is ISO 13485 and ISO 9001 certified, and its total quality management covers customer satisfaction, supplier management, product design and verification, manufacturing, and quality assurance. EFCO proudly offers our customers innovative products and services with the highest level of quality. Note: All product specifications are subject to change without notice. ver.2024/8

3. Up-500 Series (Up-570) Intel® Atom™ Processors Compact Fanless Box Computers • Intel Atom®x6000E, Intel® Celeron® J and Intel® Pentium® Processors • 2 x LAN RJ45/ 1 x USB3.1 Type C/ 2 x USB 3.1/ 2 x USB 2.0 • 1 x DisplayPort/ 1 x DC-In (12 VDC)/ 1 x COM/ 1 x Audio • 1x M.2 key ID B type 2280 (2 PCIe lanes/SATA, USB 2.0) 1x M.2 key ID E type 2230 (1 PCIe lane, USB 2.0) Up-500 Series • Intel® Atom™ Processors Compact Fanless Box Computers • Compact Pico-ITX board- based system: 161(W) x 77(D) x 67.4(H) mm • Low Power CPUs from 6 to 12Watt TDP • Extended Operating Temperature variants for harsh environments (-40°C to +85°C) • Long life components for 24/7 embedded use • DIN rail and terminal block DC-In design suitable for industrial application • REAL-TIME SYSTEMS Hypervisor supported TPC Series Intel® Core™ U Series Full HD Industrial Panel PC TPC-15U7 series • 15.6” Full HD TFT LED LCD • Dimensions: 391.5x 242x 69 mm TPC-21U7 series • 21.5” Full HD TFT LED LCD • Dimensions: 537.8 x 329 x 87 mm TPC-24U7 series • 23.8” Full HD TFT LED LCD • Dimensions: 578.6 x 350.6 x 79 mm • Intel® Gen. 7th Core™ i7, i5, i3 and Celeron® processor • IP65 Compliant aluminum front bezel • Fanless operation@ -10~60°C environment (TPC-15U7 only) • Internal multiple Mini card & M.2 slot for expansion • Suitable for Automation, HMI, general purpose applications • Wide-Range DC voltage input: 9V~36V • 2x DP/ 16-bit programmable GPIO/ 2x RJ45 GbE/ 1x audio • 4x USB 3.0 ports/ 1x RS-232/422/485 port/1x RS-232 port • 2x Mini-PCIe with USIM socket/ 1x mSATA socket/ 1x 2.5” SATA/ 1x M.2 M Key 2242 PCIe/SATA [internal expansion]

2. U7-100 Series (U7-170 ) Intel® Atom™, Celeron® Ultra-slim Fanless Box Computers • Intel® Atom™ Processor, Celeron® Processor (formerly Apollo/ Elkhart Lake) • Ultra-slim size: 173 x 88 x 21.7mm (6.81” x 3.46” x 0.85”) • Wide-Range DC voltage input: 9V~32V • Cableless, fanless system, aluminum alloy structure • Wi-Fi and cellular network support • 2x Mini-PCIe with USIM socket/ 1x mSATA socket • 16-bit programmable GPIO/ 2x RJ45 GbE • 1x USB 3.0/2.0 port, 4x USB2.0 ports/ 1x RS-232 port U8-100 Series Intel® Atom™, Celeron® Pentium® Ultra-slim Fanless Box Computers • Intel® Atom™ Processor, Celeron® Processor (formerly Apollo Lake/ Elkhart Lake) • Ultra-slim size: 188 x 94.5 x 25mm (7.4” x 3.72” x 0.98”) • Wide-Range DC voltage input: 12V~24V (DC Jack) • Cableless, fanless system, aluminum alloy structure • 2x M.2 slots support storage/Wi-Fi/5G • 1x mSATA socket • 11-bit programmable GPIO • 2x RJ45 GbE • 1x USB 3.0/2.0 port, 3x USB 2.0 ports • 1x UART RS-232 port U6-500 Series (U6-580) Intel® Core™ Processor Ultra-compact Fanless Box Computers • Compact size: 229.8 x 129 x 64.9 mm • 8th Gen. Intel® Core™ processor (formerly Whiskey Lake) • Wide-Range DC voltage input: 9V~32V • Fanless system, aluminum alloy structure • 6x RJ45 GbE Ethernet/ 1x RS-232/422/485, 5x RS-232 • Multi display: 1x DDI/VGA and 1x DP • 2x Mini-PCIe with SIM socket (PCIe + USB + USIM) • 1x mSATA socket, 1x 2.5” drive bay for HDD/SSD • 16-bit programmable GPIO • Operation Temperature: -20°C ~60°C (-4°F~140°F) Compact Fanless Box PC U Series